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The
Manufacturing Process
consists of several process stages, as given below:
Printing
/ Dispensing:
Depending on the nature of the product either
solder paste is printed on the surface of the PCB with the
help of a fully automatic screen printer or the glue is
dispensed with the help of a fully automatic glue dispenser
and move on the conveyor system to the automatic placement
machines
SMT
Component Placements:
On Glue / Solder pasted
printed PCB’s, SMT components such as QFP, SOIC, SOT, BGA,
Chip Resistors and Chip Capacitors are placed with the help of
Automatic Pick n Place Machines (Chip Shooter and Fine Pitch
Placer) at a
placement rate of 50,000 components per hour with an accuracy
of 10 microns |
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Re
flow Soldering ;
The component mounted PCB’s move on the conveyor system into a reflow oven at
a temperature of 100 to 240 degrees centigrade to solder the components on the
surface of the PCB.Lead-Free process option available .
Auto
Insertion:
As the name implies various thru-hole
components like resistors, capacitors and jumpers are inserted automatically
into the PCB by using Axial, Radial & Jumper Forming & Inserting
Machines.
Special
Components Insertion :
Few components which are odd in shape and in
nature such as different type of connectors, heat sinks. Quartz crystal etc are
manually inserted on the PCB after forming their Leads on the Lead
forming Machines.
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The
manufacturing process consists of several process stages,
as given below:
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Electronics
Manufacturing & Services..
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Full E.S.D
Protection |
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